No-Clean Lead-Free Soldering Flux Paste SMD PCB Repair
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- High Activity Rosin Can Help To Remove The Oxide Layer On The Welding Surface Easily
- Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
- Low Residue: No Clean Solder Wick, As Only a Small Amount of Residue is Left After Use, Saving You Time On Cleaning
- Lead-Free, Halogen Free, Excellent Wetting, Non-Corrosive, Good Flow Ability
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance
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Select a product to estimate shipping.Need to repair small circuit boards or electronics? SoPagre’s No-Clean Lead-Free Soldering Flux Paste is designed for precision work, offering a smooth and efficient soldering experience. This paste helps remove oxide layers for optimal solder flow and minimizes residue.
Key Highlights
- Easy Oxide Removal: The high activity rosin formula quickly removes oxidation from the welding surface.
- Smooth Flowing: The pushing-type design ensures a consistent and even flow of flux during soldering.
- Reduced Waste: Minimizes material waste due to its controlled flow, making it efficient for small repairs.
- Low Residue: Leaves minimal residue after use, reducing the time needed for post-soldering cleaning.
- Excellent Wetting: Provides superior wetting properties for strong solder joints.
Useful Facts
- Manufacturer: SoPagre
- Item Weight: 3.2 ounces (92g)
- Dimensions: 7.6 x 5.04 x 1.26 inches
- Quantity: 1 Set (1 tube of solder paste)
- First Available: April 2, 2026
Good Fit For
- Circuit board repair and maintenance
- Electronics repair (ICs, motors, lighting, TVs)
- SMT (Surface Mount Technology) work
- DIY electronics projects
- General household appliance repair
Product details
| Main Specification | |
|---|---|
| 制造商 | SoPagre |
| 品牌 | SoPagre |
| 项目包数量 | 页:1 |
| 包含的组成部分 | 1 Set Solder Paste |
| 电源 | 手动 |
| 项目重量 | 3.2盎司(3盎司) |
| Product information | |
| 软件包尺寸 | 7.6 x 5.04 x 1.26 inches |
| 项目型号 | MN-019 |
| Others | |
| 第一次可用日期 | 2026 (英语). or April 2 |
| 产品类型 | Soldering Flux |